- Developing Miniature Power Blocks Attached to Wafer-Scaled IC
- Mixed Fluid-Heat Transfer for Thermal Modeling and Analysis of a Wafer-Scale Integrated Circuit
- Characterization of Anisotropic Conductive Film Based on Vertical Fibers for Post-CMOS Wafer-Level Packaging
- Small Die Handling for Post-Processing using ICP-DRIE
- Sourcing and Design Considerations for Incorporating Through-Silicon Via on a Wafer-Scale Integrated Circuit
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